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Meyer Burger Investor Presentation

Driving the technology roadmap: several new products launched at the SNEC 2018 Diamond wire saw DW 291 2018 DW 291 ■ Increased throughput ■ Overall production costs per wafer reduced by 20% Leading thin wire ☐ capability (50 μm) Cell coating MAIA® 6.1, DIVA® 6.1 and FABIAⓇ 4.1 FABIA® 4.1 ■ Increased throughput Wafer Inspection System WIS 08 WIS 08 from 3,200 wafers per hour (wph) to > 4,000 and > 6,000 wph Integrated solution: three process-steps in one run ■ Sets performance ■ benchmark in PV industry Highest throughput with 8,300 wph with best measurement accuracy MEYER BURGER Impressions from the Meyer Burger booth at SNEC 480 480 ESIVIT 12 Meyer Burger Technology Ltd, Presentation for Investors, Analysts and Media

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